3M™ Diamond Pad Conditioner S122, 4-in dia
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3M™ Diamond Pad Conditioner S122, 4-in dia

3M™ Diamond Pad Conditioner S122, 4-in dia

  • 3M ID7000000262
    SAP ID7000000262
    Legacy SKU60020012690
    Part NumberS122
    Local Catalog IdentifierS122
    Base SKUB5005035338
    Keywords3M, diamond pad conditioner, CMP pad conditioner, chemical mechanical planarization, semiconductor applications, abrasive technology, diamond retention, planarization efficiency, pad wear uniformity, corrosion resistance, customizable conditioning, 3M disks, metal contamination reduction, semiconductor industry, electronics market, longer pad life, maintenance reduction, polishing performance, wafer consistency, tungsten processes, silicon carbide processes, CMP pad usage, aggressive conditioning, pad planarity, 3M CMP pad conditioner coatings, polymer substrate, abrasive grid, CMP pad performance.
    Brand3M™
    Global Product HierarchyCMP Pad Conditioners
    Commodity2630 - Semiconductor Materials
  • Base (B) - Article Number00051111700334
    Unit of Use (1) - Article Number00051111700334
    Shipper (6) - Article Number50051111700339
  • Marketplace Formal Name3M™ Diamond Pad Conditioner S122, 4-in dia
    Material DescriptionS122 Dia Pad Cond, 4 IN
    Marketplace Description3M™ Diamond Pad Conditioner is a highly engineered chemical mechanical planarization (CMP) pad conditioner that delivers reliable performance for critical semiconductor CMP applications. It helps minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.
    Marketplace Description ExtendedFor metal-sensitive processes, 3M™ CMP Pad Conditioner Coatings can be factory-applied to 3M™ Diamond Pad Conditioners. These micron-thin coatings are used in advanced and mature node processes sensitive to metal, or with the harsh slurries often incorporated into tungsten or silicon carbide processes. They require minimal process changes and can help reduce metal contamination by up to 99% while maintaining flatness, aggressiveness and polishing performance.
    Bullets
    • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
    • Customizable for conditioning aggressiveness
    • Diamonds secured with both chemical and mechanical bonds for great retention
    • Exclusive polymer substrate enhances corrosion resistance
    • For metal-sensitive processes, combine with 3M™ CMP Pad Conditioner Coatings
    • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
    • Optimized for extended pad and disk life
    • Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity
  • Abrasive MaterialNickel-based Alloy with Patterned Diamond
    Application
    • Advanced Node (Memory & Logic)
    • Wafer Manufacturing
    • Hard Disk Drive Manufacturing
    • CMP
  • Carrier Diameter (Imperial)4 in
    Carrier Diameter (Metric)101.6 mm
    Carrier Material410 Stainless Steel
    CMP Process
    • Cu (Bulk)
    • PMD/ILD
    • STI Process
    • W (Bulk)
  • Diamond Size151 μm
  • Product SeriesS122
    Product TypePad Conditioner
  • Return Policy DescriptionSpecial Rule: Refer to CoS Policy
    Sales unitEA
    SAP Shelf Life In Days0
    Target Warehouse Location Lead Time43
    SAP External Material Group31191500
  • Base (B) - Billing UnitEA
    Base (B) - Customary Cubic Dimension2.99213 IN3
    Base (B) - Customary Gross Weight0.95543 LB
    Base (B) - Customary Net Weight0.95521 LB
    Base (B) - Customary Height Dimension0.18701 IN
    Base (B) - Customary Length Dimension4 IN
    Base (B) - Customary Width Dimension4 IN
    Base (B) - Metric Net Weight0.4332 KG
    Base (B) - Metric Cubic Dimension49.032 CCM
    Base (B) - Metric Height Dimension0.475 CM
    Base (B) - Metric Length Dimension10.16 CM
    Base (B) - Metric Width Dimension10.16 CM
    Base (B) - Item Quantity1
    Base (B) - UnitEA
  • Consumer (2) - Item Quantity0
  • Inner (3) - Item Quantity0
  • Shipper (6) - Billing UnitEA
    Shipper (6) - Customary Cubic Dimension1586.28059 IN3
    Shipper (6) - Customary Gross Weight10.00166 LB
    Shipper (6) - Customary Net Weight9.55206 LB
    Shipper (6) - Customary Height Dimension10.7874 IN
    Shipper (6) - Customary Length Dimension14.09449 IN
    Shipper (6) - Customary Width Dimension10.43307 IN
    Shipper (6) - Metric Weight4.5359 KG
    Shipper (6) - Metric Net Weight4.332 KG
    Shipper (6) - Metric Cubic Dimension25994.38 CCM
    Shipper (6) - Metric Height Dimension27.4 CM
    Shipper (6) - Metric Length Dimension35.8 CM
    Shipper (6) - Metric Width Dimension26.5 CM
    Shipper (6) - Item Quantity10
    Shipper (6) - UnitCS
  • Pallet (8) - Billing UnitEA
    Pallet (8) - Customary Cubic Dimension92634.40532 IN3
    Pallet (8) - Customary Gross Weight529.2 LB
    Pallet (8) - Customary Net Weight458.49888 LB
    Pallet (8) - Customary Height Dimension48.0315 IN
    Pallet (8) - Customary Length Dimension48.0315 IN
    Pallet (8) - Customary Width Dimension40.15748 IN
    Pallet (8) - Metric Weight240.0 KG
    Pallet (8) - Metric Net Weight207.936 KG
    Pallet (8) - Metric Cubic Dimension1518000.0 CCM
    Pallet (8) - Metric Height Dimension122.0 CM
    Pallet (8) - Metric Length Dimension122.0 CM
    Pallet (8) - Metric Width Dimension102.0 CM
    Pallet (8) - Item Quantity480
    Pallet (8) - UnitPAL