3M™ Diamond Pad Conditioner A153L, 4.25-in dia
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3M™ Diamond Pad Conditioner A153L, 4.25-in dia

3M™ Diamond Pad Conditioner A153L, 4.25-in dia

  • 3M ID7000000265
    SAP ID7000000265
    Legacy SKU60020015180
    Part NumberA153L
    Local Catalog IdentifierA153L
    Base SKUB5005035338
    Keywords3M, diamond pad conditioner, CMP pad conditioner, chemical mechanical planarization, semiconductor applications, abrasive technology, diamond retention, planarization efficiency, pad wear uniformity, corrosion resistance, customizable conditioning, 3M disks, metal contamination reduction, semiconductor industry, electronics market, longer pad life, maintenance reduction, polishing performance, wafer consistency, tungsten processes, silicon carbide processes, CMP pad usage, aggressive conditioning, pad planarity, 3M CMP pad conditioner coatings, polymer substrate, abrasive grid, CMP pad performance.
    Brand3M™
    Global Product HierarchyCMP Pad Conditioners
    Commodity2630 - Semiconductor Materials
  • Base (B) - Article Number00051111722831
    Consumer (2) - Article Number00051111722831
  • Marketplace Formal Name3M™ Diamond Pad Conditioner A153L, 4.25-in dia
    Material DescriptionA153L Dia Pad Cond, 4.25 IN
    Marketplace Description3M™ Diamond Pad Conditioner is a highly engineered chemical mechanical planarization (CMP) pad conditioner that delivers reliable performance for critical semiconductor CMP applications. It helps minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.
    Marketplace Description ExtendedFor metal-sensitive processes, 3M™ CMP Pad Conditioner Coatings can be factory-applied to 3M™ Diamond Pad Conditioners. These micron-thin coatings are used in advanced and mature node processes sensitive to metal, or with the harsh slurries often incorporated into tungsten or silicon carbide processes. They require minimal process changes and can help reduce metal contamination by up to 99% while maintaining flatness, aggressiveness and polishing performance.
    Bullets
    • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
    • Customizable for conditioning aggressiveness
    • Diamonds secured with both chemical and mechanical bonds for great retention
    • Exclusive polymer substrate enhances corrosion resistance
    • For metal-sensitive processes, combine with 3M™ CMP Pad Conditioner Coatings
    • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
    • Optimized for extended pad and disk life
    • Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity
  • Abrasive MaterialNickel-based Alloy with Patterned Diamond
    Application
    • Advanced Node (Memory & Logic)
    • Wafer Manufacturing
    • Hard Disk Drive Manufacturing
    • CMP
  • Carrier Diameter (Imperial)4.25 in
    Carrier Diameter (Metric)107.95 mm
    Carrier Material304 Stainless Steel
    CMP Process
    • Cu (Barrier)
    • Final Buff
    • STI Process
    • W (Buff)
  • Diamond Size151 μm
  • Product SeriesA153L
    Product TypePad Conditioner
  • Return Policy DescriptionSpecial Rule: Refer to CoS Policy
    Sales unitEA
    SAP Shelf Life In Days0
    Target Warehouse Location Lead Time43
    SAP External Material Group31191500
  • Base (B) - Billing UnitEA
    Base (B) - Customary Cubic Dimension106.87539 IN3
    Base (B) - Customary Gross Weight1.05018 LB
    Base (B) - Customary Net Weight0.95016 LB
    Base (B) - Customary Height Dimension9.5 IN
    Base (B) - Customary Length Dimension1.25 IN
    Base (B) - Customary Width Dimension9 IN
    Base (B) - Metric Net Weight0.430913 KG
    Base (B) - Metric Cubic Dimension1751.367 CCM
    Base (B) - Metric Height Dimension24.13 CM
    Base (B) - Metric Length Dimension3.175 CM
    Base (B) - Metric Width Dimension22.86 CM
    Base (B) - Item Quantity1
    Base (B) - UnitEA
  • Consumer (2) - Billing UnitEA
    Consumer (2) - Customary Cubic Dimension106.87539 IN3
    Consumer (2) - Customary Gross Weight1.05018 LB
    Consumer (2) - Customary Net Weight0.95016 LB
    Consumer (2) - Customary Height Dimension9.5 IN
    Consumer (2) - Customary Length Dimension1.25 IN
    Consumer (2) - Customary Width Dimension9 IN
    Consumer (2) - Metric Weight0.476272 KG
    Consumer (2) - Metric Net Weight0.430913 KG
    Consumer (2) - Metric Cubic Dimension1751.367 CCM
    Consumer (2) - Metric Height Dimension24.13 CM
    Consumer (2) - Metric Length Dimension3.175 CM
    Consumer (2) - Metric Width Dimension22.86 CM
    Consumer (2) - Item Quantity1
    Consumer (2) - UnitEA
  • Inner (3) - Item Quantity0
  • Shipper (6) - Item Quantity0
  • Pallet (8) - Item Quantity0