3M™ Diamond Pad Conditioner A3799, 4.25 in diameter
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3M™ Diamond Pad Conditioner A3799, 4.25 in diameter

3M™ Diamond Pad Conditioner A3799, 4.25 in diameter

  • 3M ID7000027069
    SAP ID7000027069
    Legacy SKUXC002174636
    Base SKUB5005035338
    Keywords3M, diamond pad conditioner, CMP pad conditioner, chemical mechanical planarization, semiconductor applications, abrasive technology, diamond retention, planarization efficiency, pad wear uniformity, corrosion resistance, customizable conditioning, 3M disks, metal contamination reduction, semiconductor industry, electronics market, longer pad life, maintenance reduction, polishing performance, wafer consistency, tungsten processes, silicon carbide processes, CMP pad usage, aggressive conditioning, pad planarity, 3M CMP pad conditioner coatings, polymer substrate, abrasive grid, CMP pad performance.
    Brand3M™
    Global Product HierarchyCMP Pad Conditioners
    Commodity2630 - Semiconductor Materials
  • Base (B) - Article Number04710367318019
    Consumer (2) - Article Number04710367318019
    Shipper (6) - Article Number54710367318014
  • Marketplace Formal Name3M™ Diamond Pad Conditioner A3799, 4.25 in diameter
    Material DescriptionA3799 PAD CONDITIONER,4.25" DIAM
    Marketplace Description3M™ Diamond Pad Conditioner is a highly engineered chemical mechanical planarization (CMP) pad conditioner that delivers reliable performance for critical semiconductor CMP applications. It helps minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.
    Marketplace Description ExtendedFor metal-sensitive processes, 3M™ CMP Pad Conditioner Coatings can be factory-applied to 3M™ Diamond Pad Conditioners. These micron-thin coatings are used in advanced and mature node processes sensitive to metal, or with the harsh slurries often incorporated into tungsten or silicon carbide processes. They require minimal process changes and can help reduce metal contamination by up to 99% while maintaining flatness, aggressiveness and polishing performance.
    Bullets
    • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
    • Customizable for conditioning aggressiveness
    • Diamonds secured with both chemical and mechanical bonds for great retention
    • Exclusive polymer substrate enhances corrosion resistance
    • For metal-sensitive processes, combine with 3M™ CMP Pad Conditioner Coatings
    • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
    • Optimized for extended pad and disk life
    • Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity
  • Abrasive MaterialNickel-based Alloy with Patterned Diamond
    Application
    • Advanced Node (Memory & Logic)
    • Wafer Manufacturing
    • Hard Disk Drive Manufacturing
    • CMP
  • Carrier Diameter (Imperial)4.25 in
    Carrier Diameter (Metric)107.95 mm
    Carrier Material304 Stainless Steel
    CMP ProcessW (Bulk)
  • Diamond Size151 μm
  • Product SeriesA3799
    Product TypePad Conditioner
  • ECCNEAR99
    Harmonized Tariff Schedule Nbr6805301000
    Return Policy DescriptionSpecial Rule: Refer to CoS Policy
    Sales unitEA
    SAP Shelf Life In Days1095
    Target Warehouse Location Lead Time65
    SAP External Material Group31191500
  • Base (B) - Billing UnitEA
    Base (B) - Customary Cubic Dimension129.67596 IN3
    Base (B) - Customary Gross Weight1.16204 LB
    Base (B) - Customary Net Weight0.87539 LB
    Base (B) - Metric Net Weight0.397 KG
    Base (B) - Metric Cubic Dimension2125.0 CCM
    Base (B) - Previous Packaging Level Quantity0.00
    Base (B) - Item Quantity1
    Base (B) - Total Unit Quantity0.00
    Base (B) - UnitEA
    Base (B) - Pallet Layer Quantity1.00
    Base (B) - Shipping Container Per Layer Quantity1
  • Consumer (2) - Billing UnitEA
    Consumer (2) - Customary Cubic Dimension129.67596 IN3
    Consumer (2) - Customary Gross Weight1.16204 LB
    Consumer (2) - Customary Net Weight0.87539 LB
    Consumer (2) - Metric Weight0.527 KG
    Consumer (2) - Metric Net Weight0.397 KG
    Consumer (2) - Metric Cubic Dimension2125.0 CCM
    Consumer (2) - Item Quantity1
    Consumer (2) - UnitEA
  • Inner (3) - Item Quantity0
  • Shipper (6) - Billing UnitEA
    Shipper (6) - Customary Cubic Dimension1296.75963 IN3
    Shipper (6) - Customary Gross Weight11.62035 LB
    Shipper (6) - Customary Net Weight8.75385 LB
    Shipper (6) - Customary Height Dimension9.84252 IN
    Shipper (6) - Customary Length Dimension13.38583 IN
    Shipper (6) - Customary Width Dimension9.84252 IN
    Shipper (6) - Metric Weight5.27 KG
    Shipper (6) - Metric Net Weight3.97 KG
    Shipper (6) - Metric Cubic Dimension21250.0 CCM
    Shipper (6) - Metric Height Dimension25.0 CM
    Shipper (6) - Metric Length Dimension34.0 CM
    Shipper (6) - Metric Width Dimension25.0 CM
    Shipper (6) - Previous Packaging Level Quantity1.00
    Shipper (6) - Item Quantity10
    Shipper (6) - Total Unit Quantity1.00
    Shipper (6) - UnitCS
  • Pallet (8) - Billing UnitEA
    Pallet (8) - Previous Packaging Level Quantity0.00
    Pallet (8) - Previous Packaging Level UnitBOX
    Pallet (8) - Item Quantity480
    Pallet (8) - Total Unit Quantity1.00
    Pallet (8) - UnitPAL
    Pallet (8) - Pallet Layer Quantity1.00
    Pallet (8) - Shipping Container Per Layer Quantity1