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3M™ Diamond Pad Conditioner SA Experimental Disk SG
3M™ Diamond Pad Conditioner SA Experimental Disk SG
3M ID 7100001020 SAP ID 7100001020 Legacy SKU XA004112588 Local Catalog Identifier EXP Base SKU B5005035338 Keywords 3M, diamond pad conditioner, CMP pad conditioner, chemical mechanical planarization, semiconductor applications, abrasive technology, diamond retention, planarization efficiency, pad wear uniformity, corrosion resistance, customizable conditioning, 3M disks, metal contamination reduction, semiconductor industry, electronics market, longer pad life, maintenance reduction, polishing performance, wafer consistency, tungsten processes, silicon carbide processes, CMP pad usage, aggressive conditioning, pad planarity, 3M CMP pad conditioner coatings, polymer substrate, abrasive grid, CMP pad performance. Brand 3M™ Global Product Hierarchy CMP Pad Conditioners Commodity 2630 - Semiconductor Materials Base (B) - Article Number 00051111725245 Unit of Use (1) - Article Number 00051111725245 Shipper (6) - Article Number 58887719192687 Marketplace Formal Name 3M™ Diamond Pad Conditioner SA Experimental Disk SG Material Description SA Experimental Disk SG Marketplace Description 3M™ Diamond Pad Conditioner is a highly engineered chemical mechanical planarization (CMP) pad conditioner that delivers reliable performance for critical semiconductor CMP applications. It helps minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency. Marketplace Description Extended For metal-sensitive processes, 3M™ CMP Pad Conditioner Coatings can be factory-applied to 3M™ Diamond Pad Conditioners. These micron-thin coatings are used in advanced and mature node processes sensitive to metal, or with the harsh slurries often incorporated into tungsten or silicon carbide processes. They require minimal process changes and can help reduce metal contamination by up to 99% while maintaining flatness, aggressiveness and polishing performance. Bullets - Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
- Customizable for conditioning aggressiveness
- Diamonds secured with both chemical and mechanical bonds for great retention
- Exclusive polymer substrate enhances corrosion resistance
- For metal-sensitive processes, combine with 3M™ CMP Pad Conditioner Coatings
- Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
- Optimized for extended pad and disk life
- Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity
Abrasive Material Nickel-based Alloy with Patterned Diamond Application - Advanced Node (Memory & Logic)
- Wafer Manufacturing
- Hard Disk Drive Manufacturing
- CMP
Carrier Material 410 Stainless Steel CMP Process All Diamond Size 251 μm Product Type Pad Conditioner ECCN EAR99 Harmonized Tariff Schedule Nbr 6805301000 Return Policy Description Special Rule: Refer to CoS Policy Sales unit EA SAP Shelf Life In Days 730 Target Warehouse Location Lead Time 65 SAP External Material Group 31191500 Base (B) - Billing Unit EA Base (B) - Customary Cubic Dimension 144.38274 IN3 Base (B) - Customary Gross Weight 0.2646 LB Base (B) - Customary Net Weight 0.06174 LB Base (B) - Metric Net Weight 0.028 KG Base (B) - Metric Cubic Dimension 2366.0 CCM Base (B) - Item Quantity 1 Base (B) - Unit EA Consumer (2) - Item Quantity 0 Inner (3) - Item Quantity 0 Shipper (6) - Billing Unit EA Shipper (6) - Customary Cubic Dimension 1443.82742 IN3 Shipper (6) - Customary Gross Weight 2.646 LB Shipper (6) - Customary Net Weight 0.6174 LB Shipper (6) - Customary Height Dimension 10.23622 IN Shipper (6) - Customary Length Dimension 13.77953 IN Shipper (6) - Customary Width Dimension 10.23622 IN Shipper (6) - Metric Weight 1.2 KG Shipper (6) - Metric Net Weight 0.28 KG Shipper (6) - Metric Cubic Dimension 23660.0 CCM Shipper (6) - Metric Height Dimension 26.0 CM Shipper (6) - Metric Length Dimension 35.0 CM Shipper (6) - Metric Width Dimension 26.0 CM Shipper (6) - Item Quantity 10 Shipper (6) - Unit CS Pallet (8) - Billing Unit EA Pallet (8) - Customary Cubic Dimension 99347.04339 IN3 Pallet (8) - Customary Gross Weight 154.35 LB Pallet (8) - Customary Net Weight 30.87 LB Pallet (8) - Customary Height Dimension 56.69291 IN Pallet (8) - Customary Length Dimension 50 IN Pallet (8) - Customary Width Dimension 35.03937 IN Pallet (8) - Metric Weight 70.0 KG Pallet (8) - Metric Net Weight 14.0 KG Pallet (8) - Metric Cubic Dimension 1628000.0 CCM Pallet (8) - Metric Height Dimension 144.0 CM Pallet (8) - Metric Length Dimension 127.0 CM Pallet (8) - Metric Width Dimension 89.0 CM Pallet (8) - Item Quantity 500 Pallet (8) - Unit PAL