3M™ Trizact™ Pad Conditioner B6-1900-5S1, 4 in
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3M™ Trizact™ Pad Conditioner B6-1900-5S1, 4 in

3M™ Trizact™ Pad Conditioner B6-1900-5S1, 4 in

  • 3M ID7100079241
    SAP ID7100079241
    Legacy SKU60020021675
    Base SKUB5005049057
    BrandTrizact™
    Global Product HierarchyCMP Pad Conditioners
    Commodity2630 - Semiconductor Materials
  • Base (B) - Article Number00051131288300
    Consumer (2) - Article Number00051131288300
  • Marketplace Formal Name3M™ Trizact™ Pad Conditioner B6-1900-5S1, 4 in
    Material DescriptionB6-1900-5S1 Trizact Pad Cond, 4 IN
    Marketplace Description3M™ Trizact™ Pad Conditioner delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). The diamond-coated ceramic construction on 3M™ Trizact™ Pad Conditioner is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives. It has a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance.
    Bullets
    • 3D microreplicated structures help manufacturers deliver precision and control for unique requirements
    • Combine with 3M™ CMP Pad Conditioner Coatings for additional protection from metal contamination
    • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
    • Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life
    • Metal-free cutting surface for advanced node processes sensitive to metal contamination
    • Outstanding disk-to-disk consistency for predictive performance
  • Abrasive MaterialCVD coated ceramic
    Application
    • Advanced Node (Memory & Logic)
    • Wafer Manufacturing
    • CMP
  • Carrier Diameter (Imperial)4 in
    Carrier Diameter (Metric)101.6 mm
    Carrier Material410 Stainless Steel
    CMP ProcessSTI Process
  • Diamond Size0.0
  • Product SeriesB6-1900
    Product TypePad Conditioner
  • ECCNEAR99
    Harmonized Tariff Schedule Nbr6805301000
    Return Policy DescriptionSpecial Rule: Refer to CoS Policy
    Sales unitEA
    SAP Shelf Life In Days720
    Target Warehouse Location Lead Time20
    SAP External Material Group39120000
  • Base (B) - Billing UnitEA
    Base (B) - Customary Cubic Dimension106.87539 IN3
    Base (B) - Customary Gross Weight0.75013 LB
    Base (B) - Customary Net Weight0.6001 LB
    Base (B) - Customary Height Dimension9.5 IN
    Base (B) - Customary Length Dimension1.25 IN
    Base (B) - Customary Width Dimension9 IN
    Base (B) - Metric Net Weight0.272155 KG
    Base (B) - Metric Cubic Dimension1751.367 CCM
    Base (B) - Metric Height Dimension24.13 CM
    Base (B) - Metric Length Dimension3.175 CM
    Base (B) - Metric Width Dimension22.86 CM
    Base (B) - Item Quantity1
    Base (B) - UnitEA
  • Consumer (2) - Billing UnitEA
    Consumer (2) - Customary Cubic Dimension106.87539 IN3
    Consumer (2) - Customary Gross Weight0.75013 LB
    Consumer (2) - Customary Net Weight0.6001 LB
    Consumer (2) - Customary Height Dimension9.5 IN
    Consumer (2) - Customary Length Dimension1.25 IN
    Consumer (2) - Customary Width Dimension9 IN
    Consumer (2) - Metric Weight0.340194 KG
    Consumer (2) - Metric Net Weight0.272155 KG
    Consumer (2) - Metric Cubic Dimension1751.367 CCM
    Consumer (2) - Metric Height Dimension24.13 CM
    Consumer (2) - Metric Length Dimension3.175 CM
    Consumer (2) - Metric Width Dimension22.86 CM
    Consumer (2) - Item Quantity1
    Consumer (2) - UnitEA
  • Inner (3) - Item Quantity0
  • Shipper (6) - Item Quantity0
  • Pallet (8) - Item Quantity0