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3M™ Diamond Pad Conditioner A165-CIP1, 4.25 in dia
3M™ Diamond Pad Conditioner A165-CIP1, 4.25 in dia
3M ID 7100091276 SAP ID 7100091276 Legacy SKU 60020021618 Local Catalog Identifier A165-CIP1 Base SKU B5005035338 Keywords 3M, diamond pad conditioner, CMP pad conditioner, chemical mechanical planarization, semiconductor applications, abrasive technology, diamond retention, planarization efficiency, pad wear uniformity, corrosion resistance, customizable conditioning, 3M disks, metal contamination reduction, semiconductor industry, electronics market, longer pad life, maintenance reduction, polishing performance, wafer consistency, tungsten processes, silicon carbide processes, CMP pad usage, aggressive conditioning, pad planarity, 3M CMP pad conditioner coatings, polymer substrate, abrasive grid, CMP pad performance. Brand 3M™ Global Product Hierarchy CMP Pad Conditioners Commodity 2630 - Semiconductor Materials Base (B) - Article Number 00051131287600 Consumer (2) - Article Number 00051131287600 Shipper (6) - Article Number 50051131287605 Marketplace Formal Name 3M™ Diamond Pad Conditioner A165-CIP1, 4.25 in dia Material Description A165-CIP1 Dia Pad Cond, 4.25 IN Marketplace Description 3M™ Diamond Pad Conditioner is a highly engineered chemical mechanical planarization (CMP) pad conditioner that delivers reliable performance for critical semiconductor CMP applications. It helps minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency. Marketplace Description Extended For metal-sensitive processes, 3M™ CMP Pad Conditioner Coatings can be factory-applied to 3M™ Diamond Pad Conditioners. These micron-thin coatings are used in advanced and mature node processes sensitive to metal, or with the harsh slurries often incorporated into tungsten or silicon carbide processes. They require minimal process changes and can help reduce metal contamination by up to 99% while maintaining flatness, aggressiveness and polishing performance. Bullets - Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
- Customizable for conditioning aggressiveness
- Diamonds secured with both chemical and mechanical bonds for great retention
- Exclusive polymer substrate enhances corrosion resistance
- For metal-sensitive processes, combine with 3M™ CMP Pad Conditioner Coatings
- Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
- Optimized for extended pad and disk life
- Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity
Abrasive Material Nickel-based Alloy with Patterned Diamond Application - Advanced Node (Memory & Logic)
- Wafer Manufacturing
- Hard Disk Drive Manufacturing
- CMP
Carrier Diameter (Imperial) 4.25 in Carrier Diameter (Metric) 107.95 mm Carrier Material 304 Stainless Steel CMP Process All Diamond Size 251 μm Product Series A165-CIP Product Type Pad Conditioner Return Policy Description Special Rule: Refer to CoS Policy Sales unit EA SAP Shelf Life In Days 0 Target Warehouse Location Lead Time 43 SAP External Material Group 31191500 Base (B) - Billing Unit EA Base (B) - Customary Cubic Dimension 41.01581 IN3 Base (B) - Customary Gross Weight 1.25024 LB Base (B) - Customary Net Weight 1.23017 LB Base (B) - Customary Height Dimension 6.25 IN Base (B) - Customary Length Dimension 1.05 IN Base (B) - Customary Width Dimension 6.25 IN Base (B) - Metric Net Weight 0.5579 KG Base (B) - Metric Cubic Dimension 672.126 CCM Base (B) - Metric Height Dimension 15.875 CM Base (B) - Metric Length Dimension 2.667 CM Base (B) - Metric Width Dimension 15.875 CM Base (B) - Item Quantity 1 Base (B) - Unit EA Consumer (2) - Billing Unit EA Consumer (2) - Customary Cubic Dimension 41.01581 IN3 Consumer (2) - Customary Gross Weight 1.25024 LB Consumer (2) - Customary Net Weight 1.23017 LB Consumer (2) - Customary Height Dimension 6.25 IN Consumer (2) - Customary Length Dimension 1.05 IN Consumer (2) - Customary Width Dimension 6.25 IN Consumer (2) - Metric Weight 0.567 KG Consumer (2) - Metric Net Weight 0.5579 KG Consumer (2) - Metric Cubic Dimension 672.126 CCM Consumer (2) - Metric Height Dimension 15.875 CM Consumer (2) - Metric Length Dimension 2.667 CM Consumer (2) - Metric Width Dimension 15.875 CM Consumer (2) - Item Quantity 1 Consumer (2) - Unit EA Inner (3) - Item Quantity 0 Shipper (6) - Billing Unit EA Shipper (6) - Customary Cubic Dimension 1548.13816 IN3 Shipper (6) - Customary Gross Weight 13.00068 LB Shipper (6) - Customary Net Weight 12.3017 LB Shipper (6) - Customary Height Dimension 10.74803 IN Shipper (6) - Customary Length Dimension 13.85827 IN Shipper (6) - Customary Width Dimension 10.3937 IN Shipper (6) - Metric Weight 5.896 KG Shipper (6) - Metric Net Weight 5.579 KG Shipper (6) - Metric Cubic Dimension 25369.34 CCM Shipper (6) - Metric Height Dimension 27.3 CM Shipper (6) - Metric Length Dimension 35.2 CM Shipper (6) - Metric Width Dimension 26.4 CM Shipper (6) - Item Quantity 10 Shipper (6) - Unit CS Pallet (8) - Billing Unit EA Pallet (8) - Customary Cubic Dimension 97211.204 IN3 Pallet (8) - Customary Gross Weight 705.6 LB Pallet (8) - Customary Net Weight 639.68814 LB Pallet (8) - Customary Height Dimension 48.0315 IN Pallet (8) - Customary Length Dimension 48.0315 IN Pallet (8) - Customary Width Dimension 42.12598 IN Pallet (8) - Metric Weight 320.0 KG Pallet (8) - Metric Net Weight 290.108 KG Pallet (8) - Metric Cubic Dimension 1593000.0 CCM Pallet (8) - Metric Height Dimension 122.0 CM Pallet (8) - Metric Length Dimension 122.0 CM Pallet (8) - Metric Width Dimension 107.0 CM Pallet (8) - Item Quantity 520 Pallet (8) - Unit PAL