3M™ Diamond Pad Conditioner A2865, 4 in dia, 10 Ea/Case
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3M™ Diamond Pad Conditioner A2865, 4 in dia, 10 Ea/Case

3M™ Diamond Pad Conditioner A2865, 4 in dia, 10 Ea/Case

  • 3M ID7100126752
    SAP ID7100126752
    Legacy SKUXA004175668
    Base SKUB5005035338
    Keywords3M, diamond pad conditioner, CMP pad conditioner, chemical mechanical planarization, semiconductor applications, abrasive technology, diamond retention, planarization efficiency, pad wear uniformity, corrosion resistance, customizable conditioning, 3M disks, metal contamination reduction, semiconductor industry, electronics market, longer pad life, maintenance reduction, polishing performance, wafer consistency, tungsten processes, silicon carbide processes, CMP pad usage, aggressive conditioning, pad planarity, 3M CMP pad conditioner coatings, polymer substrate, abrasive grid, CMP pad performance.
    Brand3M™
    Global Product HierarchyCMP Pad Conditioners
    Commodity2630 - Semiconductor Materials
  • Base (B) - Article Number08887719276849
    Shipper (6) - Article Number58887719276844
  • Marketplace Formal Name3M™ Diamond Pad Conditioner A2865, 4 in dia, 10 Ea/Case
    Material DescriptionA2865 DIAMOND PAD CONDITIONER, 4 IN DIAM
    Marketplace Description3M™ Diamond Pad Conditioner is a highly engineered chemical mechanical planarization (CMP) pad conditioner that delivers reliable performance for critical semiconductor CMP applications. It helps minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.
    Marketplace Description ExtendedFor metal-sensitive processes, 3M™ CMP Pad Conditioner Coatings can be factory-applied to 3M™ Diamond Pad Conditioners. These micron-thin coatings are used in advanced and mature node processes sensitive to metal, or with the harsh slurries often incorporated into tungsten or silicon carbide processes. They require minimal process changes and can help reduce metal contamination by up to 99% while maintaining flatness, aggressiveness and polishing performance.
    Bullets
    • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
    • Customizable for conditioning aggressiveness
    • Diamonds secured with both chemical and mechanical bonds for great retention
    • Exclusive polymer substrate enhances corrosion resistance
    • For metal-sensitive processes, combine with 3M™ CMP Pad Conditioner Coatings
    • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
    • Optimized for extended pad and disk life
    • Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity
  • Abrasive MaterialNickel-based Alloy with Patterned Diamond
    Application
    • Advanced Node (Memory & Logic)
    • Wafer Manufacturing
    • Hard Disk Drive Manufacturing
    • CMP
  • Carrier Diameter (Imperial)4 in
    Carrier Diameter (Metric)101.6 mm
    Carrier Material410 Stainless Steel
    CMP ProcessCu (Bulk)
  • Diamond Size181 μm
  • Product SeriesA2865
    Product TypePad Conditioner
  • Sales unitEA
    SAP Shelf Life In Days730
    Target Warehouse Location Lead Time60
    SAP External Material Group31191500
  • Base (B) - Billing UnitEA
    Base (B) - Customary Cubic Dimension144.38274 IN3
    Base (B) - Customary Gross Weight0.73801 LB
    Base (B) - Customary Net Weight0.65489 LB
    Base (B) - Metric Net Weight0.297 KG
    Base (B) - Metric Cubic Dimension2366.0 CCM
    Base (B) - Previous Packaging Level Quantity0.00
    Base (B) - Item Quantity1
    Base (B) - Total Unit Quantity0.00
    Base (B) - UnitEA
    Base (B) - Pallet Layer Quantity1.00
    Base (B) - Shipping Container Per Layer Quantity999
  • Consumer (2) - Previous Packaging Level Quantity1.00
    Consumer (2) - Item Quantity0
    Consumer (2) - Total Unit Quantity1.00
    Consumer (2) - Item UnitDISC
  • Inner (3) - Item Quantity0
  • Shipper (6) - Billing UnitEA
    Shipper (6) - Customary Cubic Dimension1443.82742 IN3
    Shipper (6) - Customary Gross Weight7.38014 LB
    Shipper (6) - Customary Net Weight6.54885 LB
    Shipper (6) - Customary Height Dimension10.23622 IN
    Shipper (6) - Customary Length Dimension13.77953 IN
    Shipper (6) - Customary Width Dimension10.23622 IN
    Shipper (6) - Metric Weight3.347 KG
    Shipper (6) - Metric Net Weight2.97 KG
    Shipper (6) - Metric Cubic Dimension23660.0 CCM
    Shipper (6) - Metric Height Dimension26.0 CM
    Shipper (6) - Metric Length Dimension35.0 CM
    Shipper (6) - Metric Width Dimension26.0 CM
    Shipper (6) - Previous Packaging Level Quantity1.00
    Shipper (6) - Item Quantity10
    Shipper (6) - Total Unit Quantity1.00
    Shipper (6) - UnitCS
  • Pallet (8) - Billing UnitEA
    Pallet (8) - Customary Cubic Dimension99347.04339 IN3
    Pallet (8) - Customary Gross Weight404.52048 LB
    Pallet (8) - Customary Net Weight327.4425 LB
    Pallet (8) - Customary Height Dimension56.69291 IN
    Pallet (8) - Customary Length Dimension50 IN
    Pallet (8) - Customary Width Dimension35.03937 IN
    Pallet (8) - Metric Weight183.456 KG
    Pallet (8) - Metric Net Weight148.5 KG
    Pallet (8) - Metric Cubic Dimension1628000.0 CCM
    Pallet (8) - Metric Height Dimension144.0 CM
    Pallet (8) - Metric Length Dimension127.0 CM
    Pallet (8) - Metric Width Dimension89.0 CM
    Pallet (8) - Previous Packaging Level Quantity0.00
    Pallet (8) - Previous Packaging Level UnitLOOS
    Pallet (8) - Item Quantity500
    Pallet (8) - Total Unit Quantity999.00
    Pallet (8) - UnitPAL
    Pallet (8) - Pallet Layer Quantity1.00
    Pallet (8) - Shipping Container Per Layer Quantity999