3M™ Trizact™ Polishing Pad HT-250, 25.28 in OD x 9.13 in ID
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3M™ Trizact™ Polishing Pad HT-250, 25.28 in OD x 9.13 in ID

3M™ Trizact™ Polishing Pad HT-250, 25.28 in OD x 9.13 in ID

  • 3M ID7100191755
    SAP ID7100191755
    Legacy SKU60000602551
    Product NumberHT-250
    Base SKUB5005036184
    Keywords3M, 3M Trizact Polishing Pad HT-250, polishing pad, silicon wafer lapping pad, microreplicated pad, ultra-hard substrates, sapphire polishing, silicon carbide polishing, ceramic polishing, reduced thickness variation, improved removal rate, better surface finish, copper platen process alternative, no copper waste, long pad life, high removal rates, rough lapping step, easy pad replacement, flat lapping plates, waffle pattern lapping plates, electronics market, semiconductor market, composite slurry, lapping process, double-sided lapping platens, single-sided lapping platens, Trizact technology, surface finishing, wafer processing.
    BrandTrizact™
    Global Product HierarchyComposite Slurries & Polishing Pads
    Commodity2630 - Semiconductor Materials
  • Base (B) - Article Number00051111903605
  • Marketplace Formal Name3M™ Trizact™ Polishing Pad HT-250, 25.28 in OD x 9.13 in ID
    Material DescriptionHT-250 Pad 25.28inx9.13in
    Marketplace Description3M™ Trizact™ Polishing Pad HT-250 is a microreplicated silicon wafer lapping pad for finishing ultra-hard substrates such as sapphire, silicon carbide and ceramics.
    Marketplace Description ExtendedUsed in the rough lapping process step, Trizact polishing pad HT-250 is used in combination with 3M™ Trizact™ Composite Slurries. It can be adhered to single- or double-sided lapping platens.
    Bullets
    • Alternative to copper platen process with no need to re-groove copper platen and no copper in polishing waste
    • Can be directly mounted onto flat/smooth and waffle pattern lapping plates
    • Easy pad replacement
    • Effective lapping and polishing for ultra-hard substrates such as silicon carbide and ceramics
    • Good TTV
    • Good option for rough lapping step
    • Good surface finish
    • High removal rates
    • Long pad life
    • Reduced total thickness variation (TTV), improved removal rate and better surface finish compared to the copper platen process when used with 3M™ Trizact™ Composite Slurry, a good option for the rough lapping step
  • Abrasive MaterialDiamond
    Application
    • Lapping
    • Scratch Removal
    • Finishing
    • Polishing
  • GradeCoarse
  • Net Weight (Imperial)17.196 lb
    Net Weight (Metric)7.8 kg
  • Product Usage
    • Semiconductor Wafers
    • Ultra-hard Substrates
  • Substrate
    • Gallium Nitride
    • Silicon Aluminum
    • Lithium Tantalate
    • Gallium Arsenide
    • Silicon Carbide
    • Sapphire
    • Silicon Nitride
  • ECCNEAR99
    Harmonized Tariff Schedule Nbr6805301000
    Sales unitEA
    SAP Shelf Life In Days730
    Target Warehouse Location Lead Time48
    SAP External Material Group31191505
  • Base (B) - Billing UnitEA
    Base (B) - Customary Cubic Dimension4015.34753 IN3
    Base (B) - Customary Gross Weight22.59986 LB
    Base (B) - Customary Net Weight17.19894 LB
    Base (B) - Metric Net Weight7.799974 KG
    Base (B) - Metric Cubic Dimension65799.5 CCM
    Base (B) - Previous Packaging Level Quantity0.00
    Base (B) - Item Quantity1
    Base (B) - Total Unit Quantity0.00
    Base (B) - UnitEA
    Base (B) - Pallet Layer Quantity0.00
    Base (B) - Shipping Container Per Layer Quantity0
  • Consumer (2) - Item Quantity0
  • Inner (3) - Item Quantity0
  • Shipper (6) - Previous Packaging Level Quantity0.00
    Shipper (6) - Item Quantity0
    Shipper (6) - Total Unit Quantity0.00
  • Pallet (8) - Previous Packaging Level Quantity0.00
    Pallet (8) - Previous Packaging Level UnitLOOS
    Pallet (8) - Item Quantity0
    Pallet (8) - Total Unit Quantity0.00
    Pallet (8) - Pallet Layer Quantity0.00
    Pallet (8) - Shipping Container Per Layer Quantity0