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3M™ Diamond Pad Conditioner B138L, 4 in
3M™ Diamond Pad Conditioner B138L, 4 in
3M ID 7100205599 SAP ID 7100205599 Legacy SKU 80001427170 Part Number B138L Local Catalog Identifier B138L Base SKU B5005035338 Keywords 3M, diamond pad conditioner, CMP pad conditioner, chemical mechanical planarization, semiconductor applications, abrasive technology, diamond retention, planarization efficiency, pad wear uniformity, corrosion resistance, customizable conditioning, 3M disks, metal contamination reduction, semiconductor industry, electronics market, longer pad life, maintenance reduction, polishing performance, wafer consistency, tungsten processes, silicon carbide processes, CMP pad usage, aggressive conditioning, pad planarity, 3M CMP pad conditioner coatings, polymer substrate, abrasive grid, CMP pad performance. Brand 3M™ Global Product Hierarchy CMP Pad Conditioners Commodity 2630 - Semiconductor Materials Base (B) - Article Number 00051111905388 Marketplace Formal Name 3M™ Diamond Pad Conditioner B138L, 4 in Material Description 3M Diamond Pad Conditioner B138L Marketplace Description 3M™ Diamond Pad Conditioner is a highly engineered chemical mechanical planarization (CMP) pad conditioner that delivers reliable performance for critical semiconductor CMP applications. It helps minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency. Marketplace Description Extended For metal-sensitive processes, 3M™ CMP Pad Conditioner Coatings can be factory-applied to 3M™ Diamond Pad Conditioners. These micron-thin coatings are used in advanced and mature node processes sensitive to metal, or with the harsh slurries often incorporated into tungsten or silicon carbide processes. They require minimal process changes and can help reduce metal contamination by up to 99% while maintaining flatness, aggressiveness and polishing performance. Bullets - Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
- Customizable for conditioning aggressiveness
- Diamonds secured with both chemical and mechanical bonds for great retention
- Exclusive polymer substrate enhances corrosion resistance
- For metal-sensitive processes, combine with 3M™ CMP Pad Conditioner Coatings
- Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
- Optimized for extended pad and disk life
- Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity
Abrasive Material Nickel-based Alloy with Patterned Diamond Application - Advanced Node (Memory & Logic)
- Wafer Manufacturing
- Hard Disk Drive Manufacturing
- CMP
Carrier Diameter (Imperial) 4.25 in Carrier Diameter (Metric) 107.95 mm Carrier Material Stainless Steel CMP Process All Diamond Size 181 μm Product Series B138L Product Type Pad Conditioner ECCN EAR99 Harmonized Tariff Schedule Nbr 6805301000 Sales unit EA SAP Shelf Life In Days 730 Target Warehouse Location Lead Time 43 SAP External Material Group 31191500 Base (B) - Billing Unit EA Base (B) - Customary Cubic Dimension 154.26307 IN3 Base (B) - Customary Gross Weight 0.6001 LB Base (B) - Customary Net Weight 0.6001 LB Base (B) - Metric Net Weight 0.272155 KG Base (B) - Metric Cubic Dimension 2527.909 CCM Base (B) - Previous Packaging Level Quantity 0.00 Base (B) - Item Quantity 1 Base (B) - Total Unit Quantity 0.00 Base (B) - Unit EA Base (B) - Pallet Layer Quantity 0.00 Base (B) - Shipping Container Per Layer Quantity 0 Consumer (2) - Item Quantity 0 Inner (3) - Item Quantity 0 Shipper (6) - Previous Packaging Level Quantity 1.00 Shipper (6) - Item Quantity 0 Shipper (6) - Total Unit Quantity 1.00 Pallet (8) - Previous Packaging Level Quantity 0.00 Pallet (8) - Previous Packaging Level Unit LOOS Pallet (8) - Item Quantity 0 Pallet (8) - Total Unit Quantity 0.00 Pallet (8) - Pallet Layer Quantity 0.00 Pallet (8) - Shipping Container Per Layer Quantity 0