3M™ Trizact™ Pad Conditioner C75, 4.25 inch diam
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3M™ Trizact™ Pad Conditioner C75, 4.25 inch diam

3M™ Trizact™ Pad Conditioner C75, 4.25 inch diam

  • 3M ID7100248112
    SAP ID7100248112
    Legacy SKU80001445057
    Local Catalog IdentifierC75
    Base SKUB5005049057
    BrandTrizact™
    Global Product HierarchyCMP Pad Conditioners
    Commodity2630 - Semiconductor Materials
  • Marketplace Formal Name3M™ Trizact™ Pad Conditioner C75, 4.25 inch diam
    Material Description3M Trizact Pad Conditioner C75, 4.25 in
    Marketplace Description3M™ Trizact™ Pad Conditioner delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). The diamond-coated ceramic construction on 3M™ Trizact™ Pad Conditioner is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives. It has a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance.
    Bullets
    • 3D microreplicated structures help manufacturers deliver precision and control for unique requirements
    • Combine with 3M™ CMP Pad Conditioner Coatings for additional protection from metal contamination
    • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
    • Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life
    • Metal-free cutting surface for advanced node processes sensitive to metal contamination
    • Outstanding disk-to-disk consistency for predictive performance
  • Abrasive MaterialCVD coated ceramic
    Application
    • Advanced Node (Memory & Logic)
    • Wafer Manufacturing
    • CMP
  • Carrier Diameter (Imperial)4.25 in
    Carrier Diameter (Metric)107.95 mm
    Carrier Material304 Stainless Steel
    CMP ProcessCu (Barrier)
  • Diamond Size0.0
  • Product SeriesC75
    Product TypePad Conditioner
  • ECCNEAR99
    Harmonized Tariff Schedule Nbr6805301000
    Sales unitEA
    SAP Shelf Life In Days365
    Target Warehouse Location Lead Time20
    SAP External Material Group39120000
  • Base (B) - Billing UnitEA
    Base (B) - Customary Cubic Dimension95.62537 IN3
    Base (B) - Customary Gross Weight1.00017 LB
    Base (B) - Customary Net Weight0.85015 LB
    Base (B) - Customary Height Dimension1.25 IN
    Base (B) - Customary Length Dimension9 IN
    Base (B) - Customary Width Dimension8.5 IN
    Base (B) - Metric Net Weight0.385554 KG
    Base (B) - Metric Cubic Dimension1567.013 CCM
    Base (B) - Metric Height Dimension3.175 CM
    Base (B) - Metric Length Dimension22.86 CM
    Base (B) - Metric Width Dimension21.59 CM
    Base (B) - Previous Packaging Level Quantity0.00
    Base (B) - Item Quantity1
    Base (B) - Total Unit Quantity0.00
    Base (B) - UnitEA
    Base (B) - Pallet Layer Quantity0.00
    Base (B) - Shipping Container Per Layer Quantity0
  • Consumer (2) - Item Quantity0
  • Inner (3) - Item Quantity0
  • Shipper (6) - Previous Packaging Level Quantity1.00
    Shipper (6) - Item Quantity0
    Shipper (6) - Total Unit Quantity1.00
  • Pallet (8) - Previous Packaging Level Quantity0.00
    Pallet (8) - Previous Packaging Level UnitLOOS
    Pallet (8) - Item Quantity0
    Pallet (8) - Total Unit Quantity0.00
    Pallet (8) - Pallet Layer Quantity0.00
    Pallet (8) - Shipping Container Per Layer Quantity0