Main Picture
3M™ Trizact™ Polishing Pad Set HT-250, Die 580X33AB, 58.0 in x 33.875 in
3M™ Trizact™ Polishing Pad Set HT-250, Die 580X33AB, 58.0 in x 33.875 in
3M ID 7100301642 SAP ID 7100301642 Legacy SKU 80001446758 Part Number HT-250 Product Number HT-250 Base SKU B5005036184 Keywords 3M, 3M Trizact Polishing Pad HT-250, polishing pad, silicon wafer lapping pad, microreplicated pad, ultra-hard substrates, sapphire polishing, silicon carbide polishing, ceramic polishing, reduced thickness variation, improved removal rate, better surface finish, copper platen process alternative, no copper waste, long pad life, high removal rates, rough lapping step, easy pad replacement, flat lapping plates, waffle pattern lapping plates, electronics market, semiconductor market, composite slurry, lapping process, double-sided lapping platens, single-sided lapping platens, Trizact technology, surface finishing, wafer processing. Brand Trizact™ Global Product Hierarchy Composite Slurries & Polishing Pads Commodity 2630 - Semiconductor Materials Base (B) - Article Number 00048011062174 Marketplace Formal Name 3M™ Trizact™ Polishing Pad Set HT-250, Die 580X33AB, 58.0 in x 33.875 in Material Description Trizact Pad Set HT-250 58.0in x 33.875in Marketplace Description 3M™ Trizact™ Polishing Pad HT-250 is a microreplicated silicon wafer lapping pad for finishing ultra-hard substrates such as sapphire, silicon carbide and ceramics. Marketplace Description Extended Used in the rough lapping process step, Trizact polishing pad HT-250 is used in combination with 3M™ Trizact™ Composite Slurries. It can be adhered to single- or double-sided lapping platens. Bullets - Alternative to copper platen process with no need to re-groove copper platen and no copper in polishing waste
- Can be directly mounted onto flat/smooth and waffle pattern lapping plates
- Easy pad replacement
- Effective lapping and polishing for ultra-hard substrates such as silicon carbide and ceramics
- Good TTV
- Good option for rough lapping step
- Good surface finish
- High removal rates
- Long pad life
- Reduced total thickness variation (TTV), improved removal rate and better surface finish compared to the copper platen process when used with 3M™ Trizact™ Composite Slurry, a good option for the rough lapping step
Abrasive Material Diamond Application - Lapping
- Scratch Removal
- Finishing
- Polishing
Grade Coarse Product Usage - Semiconductor Wafers
- Ultra-hard Substrates
Substrate - Gallium Nitride
- Silicon Aluminum
- Lithium Tantalate
- Gallium Arsenide
- Silicon Carbide
- Sapphire
- Silicon Nitride
Sales unit SET SAP Shelf Life In Days 730 Target Warehouse Location Lead Time 94 SAP External Material Group 31191500 Base (B) - Billing Unit SET Base (B) - Customary Cubic Dimension 171.56465 IN3 Base (B) - Customary Gross Weight 1.98034 LB Base (B) - Customary Net Weight 1.98034 LB Base (B) - Metric Net Weight 0.898112 KG Base (B) - Metric Cubic Dimension 2811.43 CCM Base (B) - Previous Packaging Level Quantity 0.00 Base (B) - Item Quantity 1 Base (B) - Total Unit Quantity 0.00 Base (B) - Unit SET Base (B) - Pallet Layer Quantity 0.00 Base (B) - Shipping Container Per Layer Quantity 0 Consumer (2) - Item Quantity 0 Inner (3) - Item Quantity 0 Shipper (6) - Previous Packaging Level Quantity 1.00 Shipper (6) - Item Quantity 0 Shipper (6) - Total Unit Quantity 1.00 Pallet (8) - Previous Packaging Level Quantity 0.00 Pallet (8) - Previous Packaging Level Unit LOOS Pallet (8) - Item Quantity 0 Pallet (8) - Total Unit Quantity 0.00 Pallet (8) - Pallet Layer Quantity 0.00 Pallet (8) - Shipping Container Per Layer Quantity 0