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3M™ Trizact™ Pad Conditioner T Series T102-5, 4.25 in
3M™ Trizact™ Pad Conditioner T Series T102-5, 4.25 in
3M ID 7100310995 SAP ID 7100310995 Legacy SKU UU012743595 Product Number T Series Base SKU B5005469002 Brand Trizact™ Global Product Hierarchy CMP Pad Conditioners Commodity 2630 - Semiconductor Materials Base (B) - Article Number 04710367746362 Consumer (2) - Article Number 04710367746362 Shipper (6) - Article Number 54710367746367 Marketplace Formal Name 3M™ Trizact™ Pad Conditioner T Series T102-5, 4.25 in Material Description 3M TRIZACT PAD COND BT102-5 4.25” Marketplace Description 3M™ Trizact™ Pad Conditioner T Series delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP) processes. The advanced 3M CVD diamond coating technology on 3M™ Trizact™ Pad Conditioner T Series offers highly consistent, strong, tunable pad activation for demanding CMP specifications and processes, including advanced nodes. Each pad conditioner provides microreplication technology to precisely shape the surface topography for excellent performance, without the risk of micro and macro scratching defects posed by conventional diamond grit abrasives. Enjoy a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance. Bullets - Combine with 3M™ CMP Pad Conditioner Coatings for additional protection from metal contamination
- Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
- Enabled by proprietary 3M microreplication technology
- Extended lifetime and more stable removal rate compared to legacy designs
- Higher pad wear rate to enable a more durable, lower-lifetime-cost solution
- Improved with new microcrystalline CVD diamond coating technology
- Larger grain size for CVD diamond to enable stronger pad activation
- Metal-free cutting surface for advanced node processes sensitive to metal contamination
Abrasive Material CVD coated ceramic Application - Advanced Node (Memory & Logic)
- Wafer Manufacturing
- CMP
Carrier Diameter (Imperial) 4.25 in Carrier Diameter (Metric) 107.95 mm Carrier Material Stainless Steel CMP Process All Diamond Size 0.0 Product Series T Product Type Pad Conditioner ECCN EAR99 Sales unit EA SAP Shelf Life In Days 1095 Target Warehouse Location Lead Time 29 SAP External Material Group 31191500 Base (B) - Billing Unit EA Base (B) - Customary Cubic Dimension 144.38274 IN3 Base (B) - Customary Gross Weight 0.89347 LB Base (B) - Customary Net Weight 0.80042 LB Base (B) - Metric Net Weight 0.363 KG Base (B) - Metric Cubic Dimension 2366.0 CCM Base (B) - Item Quantity 1 Base (B) - Unit EA Consumer (2) - Billing Unit EA Consumer (2) - Customary Cubic Dimension 144.38274 IN3 Consumer (2) - Customary Gross Weight 0.89347 LB Consumer (2) - Customary Net Weight 0.80042 LB Consumer (2) - Metric Weight 0.4052 KG Consumer (2) - Metric Net Weight 0.363 KG Consumer (2) - Metric Cubic Dimension 2366.0 CCM Consumer (2) - Item Quantity 1 Consumer (2) - Unit EA Inner (3) - Item Quantity 0 Shipper (6) - Billing Unit EA Shipper (6) - Customary Cubic Dimension 1443.82742 IN3 Shipper (6) - Customary Gross Weight 8.93466 LB Shipper (6) - Customary Net Weight 8.00415 LB Shipper (6) - Customary Height Dimension 10.23622 IN Shipper (6) - Customary Length Dimension 13.77953 IN Shipper (6) - Customary Width Dimension 10.23622 IN Shipper (6) - Metric Weight 4.052 KG Shipper (6) - Metric Net Weight 3.63 KG Shipper (6) - Metric Cubic Dimension 23660.0 CCM Shipper (6) - Metric Height Dimension 26.0 CM Shipper (6) - Metric Length Dimension 35.0 CM Shipper (6) - Metric Width Dimension 26.0 CM Shipper (6) - Item Quantity 10 Shipper (6) - Unit CS Pallet (8) - Item Quantity 0