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3M™ Trizact™ Pad Conditioner T Series B75T-2990-5S2 4.25 IN
3M™ Trizact™ Pad Conditioner T Series B75T-2990-5S2 4.25 IN
3M ID 7100324323 SAP ID 7100324323 Legacy SKU 80001601329 Part Number B75T-2990-5S2 Product Number T Series Base SKU B5005469002 Brand Trizact™ Global Product Hierarchy CMP Pad Conditioners Commodity 2630 - Semiconductor Materials Base (B) - Article Number 00068060474360 Marketplace Formal Name 3M™ Trizact™ Pad Conditioner T Series B75T-2990-5S2 4.25 IN Material Description 3M TRIZACT PAD CONDITIONER B75T-2990-5S2 Marketplace Description 3M™ Trizact™ Pad Conditioner T Series delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP) processes. The advanced 3M CVD diamond coating technology on 3M™ Trizact™ Pad Conditioner T Series offers highly consistent, strong, tunable pad activation for demanding CMP specifications and processes, including advanced nodes. Each pad conditioner provides microreplication technology to precisely shape the surface topography for excellent performance, without the risk of micro and macro scratching defects posed by conventional diamond grit abrasives. Enjoy a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance. Bullets - Combine with 3M™ CMP Pad Conditioner Coatings for additional protection from metal contamination
- Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
- Enabled by proprietary 3M microreplication technology
- Extended lifetime and more stable removal rate compared to legacy designs
- Higher pad wear rate to enable a more durable, lower-lifetime-cost solution
- Improved with new microcrystalline CVD diamond coating technology
- Larger grain size for CVD diamond to enable stronger pad activation
- Metal-free cutting surface for advanced node processes sensitive to metal contamination
Abrasive Material CVD coated ceramic Application - Advanced Node (Memory & Logic)
- Wafer Manufacturing
- CMP
Carrier Diameter (Imperial) 4.25 in Carrier Diameter (Metric) 107.95 mm Carrier Material Stainless Steel CMP Process Cu (Barrier) Diamond Size 0.0 Product Series T Product Type Pad Conditioner ECCN EAR99 Sales unit EA SAP Shelf Life In Days 720 Target Warehouse Location Lead Time 20 SAP External Material Group 31000000 Base (B) - Billing Unit EA Base (B) - Customary Cubic Dimension 95.62537 IN3 Base (B) - Customary Gross Weight 0.85015 LB Base (B) - Customary Net Weight 0.85015 LB Base (B) - Metric Net Weight 0.385554 KG Base (B) - Metric Cubic Dimension 1567.013 CCM Base (B) - Previous Packaging Level Quantity 0.00 Base (B) - Item Quantity 1 Base (B) - Total Unit Quantity 0.00 Base (B) - Unit EA Base (B) - Pallet Layer Quantity 0.00 Base (B) - Shipping Container Per Layer Quantity 0 Consumer (2) - Item Quantity 0 Inner (3) - Item Quantity 0 Shipper (6) - Previous Packaging Level Quantity 1.00 Shipper (6) - Item Quantity 0 Shipper (6) - Total Unit Quantity 1.00 Pallet (8) - Previous Packaging Level Quantity 0.00 Pallet (8) - Previous Packaging Level Unit LOOS Pallet (8) - Item Quantity 0 Pallet (8) - Total Unit Quantity 0.00 Pallet (8) - Pallet Layer Quantity 0.00 Pallet (8) - Shipping Container Per Layer Quantity 0