3M™ Diamond Pad Con C Series, C2120-S, 4in, 10 Each/Case
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3M™ Diamond Pad Con C Series, C2120-S, 4in, 10 Each/Case

3M™ Diamond Pad Con C Series, C2120-S, 4in, 10 Each/Case

  • 3M ID7100326447
    SAP ID7100326447
    Legacy SKUXN400507465
    Product NumberC Series
    Base SKUB5005469001
    Brand3M™
    Global Product HierarchyCMP Pad Conditioners
    Commodity2630 - Semiconductor Materials
  • Base (B) - Article Number04550309395476
    Unit of Use (1) - Article Number04550309395476
    Shipper (6) - Article Number54550309395471
  • Marketplace Formal Name3M™ Diamond Pad Con C Series, C2120-S, 4in, 10 Each/Case
    Material DescriptionDiamond Pad Con C Series C2120-S, 4in
    Marketplace Description3M™ Diamond Pad Conditioner C Series is a highly engineered chemical mechanical planarization (CMP) pad conditioner that helps you deliver reliable performance in your critical semiconductor CMP applications. It helps minimize wear and maintains consistent asperities and consistent pad performance — for wafer after wafer. These diamond disk conditioners use 3M proprietary sintered abrasive technology for excellent diamond retention, helping enable longer life and better shape and diamond orientation control than legacy diamond pad conditioners. The improved consistency and smaller variation enable you to reduce variables and optimize your CMP performance.
    Bullets
    • 40% improvement in flatness control over legacy designs
    • A good choice for metal-sensitive processes when combined with 3M™ CMP Pad Conditioner Coatings
    • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
    • Enables potential for longer disk life and pad life
    • Improved consistency and reduced disk-to-disk variation
    • Optimized diamond shape, pitch control and diamond orientation
    • Slower pad wear rate decay with stable removal rate and profile
    • Uses 3M sintered abrasive technology for firm diamond adhesion
  • Abrasive MaterialDiamond
    Application
    • Advanced Node (Memory & Logic)
    • Wafer Manufacturing
    • CMP
  • Carrier Diameter (Imperial)4 in
    Carrier Diameter (Metric)101.6 mm
    Carrier MaterialStainless Steel
    CMP ProcessAll
  • Diamond Size250 μm
  • Product SeriesC
    Product TypePad Conditioner
  • Sales unitEA
    SAP Shelf Life In Days1095
    Target Warehouse Location Lead Time65
    SAP External Material Group31191506
  • Base (B) - Billing UnitEA
    Base (B) - Customary Cubic Dimension129.67596 IN3
    Base (B) - Customary Gross Weight0.7056 LB
    Base (B) - Customary Net Weight0.441 LB
    Base (B) - Metric Net Weight0.2 KG
    Base (B) - Metric Cubic Dimension2125.0 CCM
    Base (B) - Item Quantity1
    Base (B) - UnitEA
  • Consumer (2) - Item Quantity0
  • Inner (3) - Item Quantity0
  • Shipper (6) - Billing UnitEA
    Shipper (6) - Customary Cubic Dimension1296.75963 IN3
    Shipper (6) - Customary Gross Weight7.056 LB
    Shipper (6) - Customary Net Weight4.41 LB
    Shipper (6) - Customary Height Dimension9.84252 IN
    Shipper (6) - Customary Length Dimension13.38583 IN
    Shipper (6) - Customary Width Dimension9.84252 IN
    Shipper (6) - Metric Weight3.2 KG
    Shipper (6) - Metric Net Weight2.0 KG
    Shipper (6) - Metric Cubic Dimension21250.0 CCM
    Shipper (6) - Metric Height Dimension25.0 CM
    Shipper (6) - Metric Length Dimension34.0 CM
    Shipper (6) - Metric Width Dimension25.0 CM
    Shipper (6) - Item Quantity10
    Shipper (6) - UnitCS
  • Pallet (8) - Item Quantity0