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3M™ Trizact™ CMP Pad MR888H1C-A, 30.5 inch diameter
3M™ Trizact™ CMP Pad MR888H1C-A, 30.5 inch diameter
3M ID 7100327045 SAP ID 7100327045 Legacy SKU 80001601386 Part Number MR888H1C-A Base SKU B40045199 Keywords 3M, Trizact CMP Pads, CMP pads, microreplication technology, semiconductor manufacturing, chemical mechanical planarization, advanced node CMP, pad life, low defectivity, pad performance, pad texture consistency, planarization efficiency, reduced dishing, reduced erosion, less pad debris, fewer defects, reduced metal contamination, uniform asperity control, uniform slurry flow, microreplicated asperities, microreplicated pores, consistent performance, semiconductor fabrication, electronics industry, semiconductor industry, innovative CMP material, groove design, precise asperity control, pad uniformity, longer pad life, lower cost of ownership, less downtime, pad stability. Brand Trizact™ Global Product Hierarchy CMP Pads Commodity 2630 - Semiconductor Materials Marketplace Formal Name 3M™ Trizact™ CMP Pad MR888H1C-A, 30.5 inch diameter Material Description CMP Pad MR888H1C-A, 30.5 inch diameter Marketplace Description 3M™ Trizact™ CMP Pads use microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life. This proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner, enabling you to have lower cost of ownership and less downtime. Marketplace Description Extended An innovative CMP material, 3M™ Trizact™ CMP Pads are for advanced node semiconductor manufacturing. Their precisely engineered three-dimensional microreplicated asperities and pores helps to ensure uniform asperity diameter, height and pore depth. The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of semiconductor fabrication. The innovative groove design on these CMP pads help provide efficient and uniform slurry flow distribution. Bullets - Consistent texture from pad to pad
- Improved planarization efficiency to enable advanced node CMP
- Less pad debris for fewer defects
- Reduced dishing and erosion
- Reduced metal contamination risk
- Stability through pad life
- Uniformity in the chemical mechanical planarization (CMP) process
Application - Semiconductor Fabrication
- Advanced Node (Memory & Logic)
- Wafer Manufacturing
- CMP
Overall Diameter (Imperial) 30.5 in Overall Diameter (Metric) 774.7 mm Product Usage Semiconductor Wafers Sales unit EA SAP Shelf Life In Days 365 Target Warehouse Location Lead Time 43 SAP External Material Group 31000000 Base (B) - Billing Unit EA Base (B) - Customary Cubic Dimension 71.03802 IN3 Base (B) - Customary Gross Weight 1.73026 LB Base (B) - Customary Net Weight 1.73026 LB Base (B) - Metric Net Weight 0.7847 KG Base (B) - Metric Cubic Dimension 1164.1 CCM Base (B) - Previous Packaging Level Quantity 0.00 Base (B) - Item Quantity 1 Base (B) - Total Unit Quantity 0.00 Base (B) - Unit EA Base (B) - Pallet Layer Quantity 0.00 Base (B) - Shipping Container Per Layer Quantity 0 Consumer (2) - Item Quantity 0 Inner (3) - Item Quantity 0 Shipper (6) - Previous Packaging Level Quantity 1.00 Shipper (6) - Item Quantity 0 Shipper (6) - Total Unit Quantity 1.00 Pallet (8) - Previous Packaging Level Quantity 0.00 Pallet (8) - Previous Packaging Level Unit LOOS Pallet (8) - Item Quantity 0 Pallet (8) - Total Unit Quantity 0.00 Pallet (8) - Pallet Layer Quantity 0.00 Pallet (8) - Shipping Container Per Layer Quantity 0