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3M™ Trizact™ CMP Pad MR888H1C-W3-A, 30.5 INCH DIAMETER
3M™ Trizact™ CMP Pad MR888H1C-W3-A, 30.5 INCH DIAMETER
3M ID 7100377555 SAP ID 7100377555 Legacy SKU 80001602277 Part Number MR888H1C-W3-A Base SKU B40045199 Keywords 3M, Trizact CMP Pads, CMP pads, microreplication technology, semiconductor manufacturing, chemical mechanical planarization, advanced node CMP, pad life, low defectivity, pad performance, pad texture consistency, planarization efficiency, reduced dishing, reduced erosion, less pad debris, fewer defects, reduced metal contamination, uniform asperity control, uniform slurry flow, microreplicated asperities, microreplicated pores, consistent performance, semiconductor fabrication, electronics industry, semiconductor industry, innovative CMP material, groove design, precise asperity control, pad uniformity, longer pad life, lower cost of ownership, less downtime, pad stability. Brand Trizact™ Global Product Hierarchy CMP Pads Commodity 2630 - Semiconductor Materials Base (B) - Article Number 00068060476326 Marketplace Formal Name 3M™ Trizact™ CMP Pad MR888H1C-W3-A, 30.5 INCH DIAMETER Material Description CMP PAD MR888H1C-W3-A, 30.5 INCH DIAMETE Marketplace Description 3M™ Trizact™ CMP Pads use microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life. This proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner, enabling you to have lower cost of ownership and less downtime. Marketplace Description Extended An innovative CMP material, 3M™ Trizact™ CMP Pads are for advanced node semiconductor manufacturing. Their precisely engineered three-dimensional microreplicated asperities and pores helps to ensure uniform asperity diameter, height and pore depth. The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of semiconductor fabrication. The innovative groove design on these CMP pads help provide efficient and uniform slurry flow distribution. Bullets - Consistent texture from pad to pad
- Improved planarization efficiency to enable advanced node CMP
- Less pad debris for fewer defects
- Reduced dishing and erosion
- Reduced metal contamination risk
- Stability through pad life
- Uniformity in the chemical mechanical planarization (CMP) process
Application - Semiconductor Fabrication
- Advanced Node (Memory & Logic)
- Wafer Manufacturing
- CMP
Overall Diameter (Imperial) 30.5 in Overall Diameter (Metric) 774.7 mm Product Usage Semiconductor Wafers Sales unit EA SAP Shelf Life In Days 365 Target Warehouse Location Lead Time 60 SAP External Material Group 31000000 Base (B) - Billing Unit EA Base (B) - Customary Cubic Dimension 97.63837 IN3 Base (B) - Customary Gross Weight 2.646 LB Base (B) - Customary Net Weight 2.646 LB Base (B) - Metric Net Weight 1.2 KG Base (B) - Metric Cubic Dimension 1600.0 CCM Base (B) - Previous Packaging Level Quantity 0.00 Base (B) - Item Quantity 1 Base (B) - Total Unit Quantity 0.00 Base (B) - Unit EA Base (B) - Pallet Layer Quantity 0.00 Base (B) - Shipping Container Per Layer Quantity 0 Consumer (2) - Item Quantity 0 Inner (3) - Item Quantity 0 Shipper (6) - Previous Packaging Level Quantity 1.00 Shipper (6) - Item Quantity 0 Shipper (6) - Total Unit Quantity 1.00 Pallet (8) - Previous Packaging Level Quantity 0.00 Pallet (8) - Previous Packaging Level Unit LOOS Pallet (8) - Item Quantity 0 Pallet (8) - Total Unit Quantity 0.00 Pallet (8) - Pallet Layer Quantity 0.00 Pallet (8) - Shipping Container Per Layer Quantity 0