3M™ Trizact Pad Conditioner B5T-M992-5S2L, 4.25IN, 10 Each/Case
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3M™ Trizact Pad Conditioner B5T-M992-5S2L, 4.25IN, 10 Each/Case

3M™ Trizact Pad Conditioner B5T-M992-5S2L, 4.25IN, 10 Each/Case

  • 3M ID7100385537
    SAP ID7100385537
    Legacy SKUUU014021420
    Base SKUB5005049057
    BrandTrizact™
    Global Product HierarchyCMP Pad Conditioners
    Commodity2630 - Semiconductor Materials
  • Base (B) - Article Number00068060477545
    Unit of Use (1) - Article Number00068060477545
    Shipper (6) - Article Number50068060477540
  • Marketplace Formal Name3M™ Trizact Pad Conditioner B5T-M992-5S2L, 4.25IN, 10 Each/Case
    Material DescriptionTrizact PadConditioner B5T-M992-5S2L
    Marketplace Description3M™ Trizact™ Pad Conditioner delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). The diamond-coated ceramic construction on 3M™ Trizact™ Pad Conditioner is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives. It has a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance.
    Bullets
    • 3D microreplicated structures help manufacturers deliver precision and control for unique requirements
    • Combine with 3M™ CMP Pad Conditioner Coatings for additional protection from metal contamination
    • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
    • Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life
    • Metal-free cutting surface for advanced node processes sensitive to metal contamination
    • Outstanding disk-to-disk consistency for predictive performance
  • Abrasive MaterialCVD coated ceramic
    Application
    • Advanced Node (Memory & Logic)
    • Wafer Manufacturing
    • CMP
  • Carrier Diameter (Imperial)4.25 in
    Carrier Diameter (Metric)107.95 mm
    Carrier Material410 Stainless Steel
    CMP ProcessAll
  • Diamond Size0.0
  • Product SeriesB5-M992
    Product TypePad Conditioner
  • Sales unitEA
    SAP Shelf Life In Days730
    Target Warehouse Location Lead Time60
    SAP External Material Group31191506
  • Base (B) - Billing UnitEA
    Base (B) - Customary Cubic Dimension129.67596 IN3
    Base (B) - Customary Gross Weight1.16424 LB
    Base (B) - Customary Net Weight1.1025 LB
    Base (B) - Metric Net Weight0.5 KG
    Base (B) - Metric Cubic Dimension2125.0 CCM
    Base (B) - Item Quantity1
    Base (B) - UnitEA
  • Consumer (2) - Item Quantity0
  • Inner (3) - Item Quantity0
  • Shipper (6) - Billing UnitEA
    Shipper (6) - Customary Cubic Dimension1296.75963 IN3
    Shipper (6) - Customary Gross Weight11.6424 LB
    Shipper (6) - Customary Net Weight11.025 LB
    Shipper (6) - Customary Height Dimension9.84252 IN
    Shipper (6) - Customary Length Dimension13.38583 IN
    Shipper (6) - Customary Width Dimension9.84252 IN
    Shipper (6) - Metric Weight5.28 KG
    Shipper (6) - Metric Net Weight5.0 KG
    Shipper (6) - Metric Cubic Dimension21250.0 CCM
    Shipper (6) - Metric Height Dimension25.0 CM
    Shipper (6) - Metric Length Dimension34.0 CM
    Shipper (6) - Metric Width Dimension25.0 CM
    Shipper (6) - Item Quantity10
    Shipper (6) - UnitCS
  • Pallet (8) - Item Quantity0