3M™ MR888H1C-A, 29.5 INCH General 10EA/CV
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3M™ MR888H1C-A, 29.5 INCH General 10EA/CV

3M™ MR888H1C-A, 29.5 INCH General 10EA/CV

  • 3M ID7100403092
    SAP ID7100403092
    Legacy SKU80001603770
    Part NumberMR888H1C-A
    Base SKUB40045199
    Keywords3M, Trizact CMP Pads, CMP pads, microreplication technology, semiconductor manufacturing, chemical mechanical planarization, advanced node CMP, pad life, low defectivity, pad performance, pad texture consistency, planarization efficiency, reduced dishing, reduced erosion, less pad debris, fewer defects, reduced metal contamination, uniform asperity control, uniform slurry flow, microreplicated asperities, microreplicated pores, consistent performance, semiconductor fabrication, electronics industry, semiconductor industry, innovative CMP material, groove design, precise asperity control, pad uniformity, longer pad life, lower cost of ownership, less downtime, pad stability.
    BrandTrizact™
    Global Product HierarchyCMP Pads
    Commodity2630 - Semiconductor Materials
  • Base (B) - Article Number00068060481450
    Unit of Use (1) - Article Number00068060481450
    Consumer (2) - Article Number00068060482419
    Shipper (6) - Article Number50068060482414
  • Marketplace Formal Name3M™ MR888H1C-A, 29.5 INCH General 10EA/CV
    Material DescriptionMR888H1C-A, 29.5 INCH General 10ea/Box
    Marketplace Description3M™ Trizact™ CMP Pads use microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life. This proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner, enabling you to have lower cost of ownership and less downtime.
    Marketplace Description ExtendedAn innovative CMP material, 3M™ Trizact™ CMP Pads are for advanced node semiconductor manufacturing. Their precisely engineered three-dimensional microreplicated asperities and pores helps to ensure uniform asperity diameter, height and pore depth. The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of semiconductor fabrication. The innovative groove design on these CMP pads help provide efficient and uniform slurry flow distribution.
    Bullets
    • Consistent texture from pad to pad
    • Improved planarization efficiency to enable advanced node CMP
    • Less pad debris for fewer defects
    • Reduced dishing and erosion
    • Reduced metal contamination risk
    • Stability through pad life
    • Uniformity in the chemical mechanical planarization (CMP) process
  • Application
    • Semiconductor Fabrication
    • Advanced Node (Memory & Logic)
    • Wafer Manufacturing
    • CMP
  • Overall Diameter (Imperial)29.5 in
    Overall Diameter (Metric)749.3 mm
  • Product UsageSemiconductor Wafers
  • Sales unitEA
    SAP Shelf Life In Days365
    Target Warehouse Location Lead Time45
    SAP External Material Group31000000
  • Base (B) - Billing UnitEA
    Base (B) - Customary Cubic Dimension459.42851 IN3
    Base (B) - Customary Gross Weight2.69046 LB
    Base (B) - Customary Net Weight2.00214 LB
    Base (B) - Metric Net Weight0.908001 KG
    Base (B) - Metric Cubic Dimension7528.655 CCM
    Base (B) - Item Quantity1
    Base (B) - UnitEA
  • Consumer (2) - Billing UnitEA
    Consumer (2) - Customary Cubic Dimension653.4027 IN3
    Consumer (2) - Customary Gross Weight10.40178 LB
    Consumer (2) - Customary Net Weight10.01071 LB
    Consumer (2) - Customary Height Dimension0.6 IN
    Consumer (2) - Customary Length Dimension33 IN
    Consumer (2) - Customary Width Dimension33 IN
    Consumer (2) - Metric Weight4.71736 KG
    Consumer (2) - Metric Net Weight4.540005 KG
    Consumer (2) - Metric Cubic Dimension10707.31 CCM
    Consumer (2) - Metric Height Dimension1.524 CM
    Consumer (2) - Metric Length Dimension83.82 CM
    Consumer (2) - Metric Width Dimension83.82 CM
    Consumer (2) - Item Quantity5
    Consumer (2) - UnitPAK
  • Inner (3) - Item Quantity0
  • Shipper (6) - Billing UnitEA
    Shipper (6) - Customary Cubic Dimension4594.28571 IN3
    Shipper (6) - Customary Gross Weight26.90459 LB
    Shipper (6) - Customary Net Weight20.02142 LB
    Shipper (6) - Customary Height Dimension4.1248 IN
    Shipper (6) - Customary Length Dimension33.6248 IN
    Shipper (6) - Customary Width Dimension33.1248 IN
    Shipper (6) - Metric Weight12.20163 KG
    Shipper (6) - Metric Net Weight9.08001 KG
    Shipper (6) - Metric Cubic Dimension75286.56 CCM
    Shipper (6) - Metric Height Dimension10.477 CM
    Shipper (6) - Metric Length Dimension85.407 CM
    Shipper (6) - Metric Width Dimension84.137 CM
    Shipper (6) - Item Quantity10
    Shipper (6) - UnitCS
  • Pallet (8) - Billing UnitEA
    Pallet (8) - Customary Cubic Dimension101299.81083 IN3
    Pallet (8) - Customary Gross Weight326.05556 LB
    Pallet (8) - Customary Net Weight220.2354 LB
    Pallet (8) - Customary Height Dimension50.25 IN
    Pallet (8) - Customary Length Dimension48 IN
    Pallet (8) - Customary Width Dimension42 IN
    Pallet (8) - Metric Weight147.871 KG
    Pallet (8) - Metric Net Weight99.88 KG
    Pallet (8) - Metric Cubic Dimension1660000.0 CCM
    Pallet (8) - Metric Height Dimension127.635 CM
    Pallet (8) - Metric Length Dimension121.92 CM
    Pallet (8) - Metric Width Dimension106.68 CM
    Pallet (8) - Item Quantity110
    Pallet (8) - UnitPAL