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3M™ Trizact Pad Conditioner, B75T-2990-5S1L, 4IN, 10 Each/Case
3M™ Trizact Pad Conditioner, B75T-2990-5S1L, 4IN, 10 Each/Case
3M ID 7100403195 SAP ID 7100403195 Legacy SKU UU014728123 Product Number T Series Base SKU B5005469002 Brand Trizact™ Global Product Hierarchy CMP Pad Conditioners Commodity 2630 - Semiconductor Materials Base (B) - Article Number 00068060480927 Unit of Use (1) - Article Number 00068060480927 Shipper (6) - Article Number 50068060480922 Marketplace Formal Name 3M™ Trizact Pad Conditioner, B75T-2990-5S1L, 4IN, 10 Each/Case Material Description Trizact Pad Conditioner B75T-2990-5S1L Marketplace Description 3M™ Trizact™ Pad Conditioner T Series delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP) processes. The advanced 3M CVD diamond coating technology on 3M™ Trizact™ Pad Conditioner T Series offers highly consistent, strong, tunable pad activation for demanding CMP specifications and processes, including advanced nodes. Each pad conditioner provides microreplication technology to precisely shape the surface topography for excellent performance, without the risk of micro and macro scratching defects posed by conventional diamond grit abrasives. Enjoy a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance. Bullets - Combine with 3M™ CMP Pad Conditioner Coatings for additional protection from metal contamination
- Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
- Enabled by proprietary 3M microreplication technology
- Extended lifetime and more stable removal rate compared to legacy designs
- Higher pad wear rate to enable a more durable, lower-lifetime-cost solution
- Improved with new microcrystalline CVD diamond coating technology
- Larger grain size for CVD diamond to enable stronger pad activation
- Metal-free cutting surface for advanced node processes sensitive to metal contamination
Abrasive Material CVD coated ceramic Application - Advanced Node (Memory & Logic)
- Wafer Manufacturing
- CMP
Carrier Diameter (Imperial) 4.25 in Carrier Diameter (Metric) 107.95 mm Carrier Material Stainless Steel Diamond Size 0.0 Product Series B75T-2990 Product Type Pad Conditioner Sales unit EA SAP Shelf Life In Days 720 Target Warehouse Location Lead Time 60 SAP External Material Group 31191506 Base (B) - Billing Unit EA Base (B) - Customary Cubic Dimension 129.67596 IN3 Base (B) - Customary Gross Weight 1.16424 LB Base (B) - Customary Net Weight 1.1025 LB Base (B) - Metric Net Weight 0.5 KG Base (B) - Metric Cubic Dimension 2125.0 CCM Base (B) - Item Quantity 1 Base (B) - Unit EA Consumer (2) - Item Quantity 0 Inner (3) - Item Quantity 0 Shipper (6) - Billing Unit EA Shipper (6) - Customary Cubic Dimension 1296.75963 IN3 Shipper (6) - Customary Gross Weight 11.6424 LB Shipper (6) - Customary Net Weight 11.025 LB Shipper (6) - Customary Height Dimension 9.84252 IN Shipper (6) - Customary Length Dimension 13.38583 IN Shipper (6) - Customary Width Dimension 9.84252 IN Shipper (6) - Metric Weight 5.28 KG Shipper (6) - Metric Net Weight 5.0 KG Shipper (6) - Metric Cubic Dimension 21250.0 CCM Shipper (6) - Metric Height Dimension 25.0 CM Shipper (6) - Metric Length Dimension 34.0 CM Shipper (6) - Metric Width Dimension 25.0 CM Shipper (6) - Item Quantity 10 Shipper (6) - Unit CS Pallet (8) - Item Quantity 0