3M™ A188 Dia Pad Cond 4.25 in
Main Picture

3M™ A188 Dia Pad Cond 4.25 in

3M™ A188 Dia Pad Cond 4.25 in

  • 3M ID7100406925
    SAP ID7100406925
    Legacy SKU80001604273
    Part NumberA188
    Base SKUB5005035338
    Keywords3M, diamond pad conditioner, CMP pad conditioner, chemical mechanical planarization, semiconductor applications, abrasive technology, diamond retention, planarization efficiency, pad wear uniformity, corrosion resistance, customizable conditioning, 3M disks, metal contamination reduction, semiconductor industry, electronics market, longer pad life, maintenance reduction, polishing performance, wafer consistency, tungsten processes, silicon carbide processes, CMP pad usage, aggressive conditioning, pad planarity, 3M CMP pad conditioner coatings, polymer substrate, abrasive grid, CMP pad performance.
    Brand3M™
    Global Product HierarchyCMP Pad Conditioners
    Commodity2630 - Semiconductor Materials
  • Base (B) - Article Number00068060482709
    Unit of Use (1) - Article Number00068060482709
    Shipper (6) - Article Number50068060482704
  • Marketplace Formal Name3M™ A188 Dia Pad Cond 4.25 in
    Material DescriptionA188 DIA PAD COND 4.25 IN
    Marketplace Description3M™ Diamond Pad Conditioner is a highly engineered chemical mechanical planarization (CMP) pad conditioner that delivers reliable performance for critical semiconductor CMP applications. It helps minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.
    Marketplace Description ExtendedFor metal-sensitive processes, 3M™ CMP Pad Conditioner Coatings can be factory-applied to 3M™ Diamond Pad Conditioners. These micron-thin coatings are used in advanced and mature node processes sensitive to metal, or with the harsh slurries often incorporated into tungsten or silicon carbide processes. They require minimal process changes and can help reduce metal contamination by up to 99% while maintaining flatness, aggressiveness and polishing performance.
    Bullets
    • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
    • Customizable for conditioning aggressiveness
    • Diamonds secured with both chemical and mechanical bonds for great retention
    • Exclusive polymer substrate enhances corrosion resistance
    • For metal-sensitive processes, combine with 3M™ CMP Pad Conditioner Coatings
    • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
    • Optimized for extended pad and disk life
    • Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity
  • Abrasive MaterialNickel-based Alloy with Patterned Diamond
    Application
    • Advanced Node (Memory & Logic)
    • Wafer Manufacturing
    • Hard Disk Drive Manufacturing
    • CMP
  • Carrier Diameter (Imperial)4.25 in
    Carrier Diameter (Metric)107.95 mm
    Carrier MaterialPolycarbonate
  • Diamond Size0.0
  • Product SeriesA188
    Product TypePad Conditioner
  • Sales unitEA
    SAP Shelf Life In Days730
    Target Warehouse Location Lead Time43
    SAP External Material Group31000000
  • Base (B) - Billing UnitEA
    Base (B) - Customary Cubic Dimension158.57131 IN3
    Base (B) - Customary Gross Weight1.1502 LB
    Base (B) - Customary Net Weight0.77173 LB
    Base (B) - Metric Net Weight0.349991 KG
    Base (B) - Metric Cubic Dimension2598.508 CCM
    Base (B) - Item Quantity1
    Base (B) - UnitEA
  • Consumer (2) - Item Quantity0
  • Inner (3) - Item Quantity0
  • Shipper (6) - Billing UnitEA
    Shipper (6) - Customary Cubic Dimension1585.71307 IN3
    Shipper (6) - Customary Gross Weight11.50197 LB
    Shipper (6) - Customary Net Weight7.7173 LB
    Shipper (6) - Customary Height Dimension10.76969 IN
    Shipper (6) - Customary Length Dimension14.08976 IN
    Shipper (6) - Customary Width Dimension10.45 IN
    Shipper (6) - Metric Weight5.216312 KG
    Shipper (6) - Metric Net Weight3.49991 KG
    Shipper (6) - Metric Cubic Dimension25985.08 CCM
    Shipper (6) - Metric Height Dimension27.355 CM
    Shipper (6) - Metric Length Dimension35.788 CM
    Shipper (6) - Metric Width Dimension26.543 CM
    Shipper (6) - Item Quantity10
    Shipper (6) - UnitCS
  • Pallet (8) - Billing UnitEA
    Pallet (8) - Customary Cubic Dimension96906.08409 IN3
    Pallet (8) - Customary Gross Weight582.09795 LB
    Pallet (8) - Customary Net Weight370.43118 LB
    Pallet (8) - Customary Height Dimension48.07992 IN
    Pallet (8) - Customary Length Dimension48 IN
    Pallet (8) - Customary Width Dimension42 IN
    Pallet (8) - Metric Weight263.99 KG
    Pallet (8) - Metric Net Weight167.996 KG
    Pallet (8) - Metric Cubic Dimension1588000.0 CCM
    Pallet (8) - Metric Height Dimension122.123 CM
    Pallet (8) - Metric Length Dimension121.92 CM
    Pallet (8) - Metric Width Dimension106.68 CM
    Pallet (8) - Item Quantity480
    Pallet (8) - UnitPAL