3M™ Trizact™ CMP Pad MR885H5C-W0-D, 30.5",10/case, General
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3M™ Trizact™ CMP Pad MR885H5C-W0-D, 30.5",10/case, General

3M™ Trizact™ CMP Pad MR885H5C-W0-D, 30.5",10/case, General

  • 3M ID7100415866
    SAP ID7100415866
    Legacy SKU80001447236
    Part NumberMR885H5C-W0-D
    Base SKUB40045199
    Keywords3M, Trizact CMP Pads, CMP pads, microreplication technology, semiconductor manufacturing, chemical mechanical planarization, advanced node CMP, pad life, low defectivity, pad performance, pad texture consistency, planarization efficiency, reduced dishing, reduced erosion, less pad debris, fewer defects, reduced metal contamination, uniform asperity control, uniform slurry flow, microreplicated asperities, microreplicated pores, consistent performance, semiconductor fabrication, electronics industry, semiconductor industry, innovative CMP material, groove design, precise asperity control, pad uniformity, longer pad life, lower cost of ownership, less downtime, pad stability.
    BrandTrizact™
    Global Product HierarchyCMP Pads
    Commodity2630 - Semiconductor Materials
  • Base (B) - Article Number00068060485984
    Unit of Use (1) - Article Number00068060485984
    Shipper (6) - Article Number50068060485989
  • Marketplace Formal Name3M™ Trizact™ CMP Pad MR885H5C-W0-D, 30.5",10/case, General
    Material DescriptionMR885H5C-W0-D, 30.5 In, General
    Marketplace Description3M™ Trizact™ CMP Pads use microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life. This proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner, enabling you to have lower cost of ownership and less downtime.
    Marketplace Description ExtendedAn innovative CMP material, 3M™ Trizact™ CMP Pads are for advanced node semiconductor manufacturing. Their precisely engineered three-dimensional microreplicated asperities and pores helps to ensure uniform asperity diameter, height and pore depth. The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of semiconductor fabrication. The innovative groove design on these CMP pads help provide efficient and uniform slurry flow distribution.
    Bullets
    • Consistent texture from pad to pad
    • Improved planarization efficiency to enable advanced node CMP
    • Less pad debris for fewer defects
    • Reduced dishing and erosion
    • Reduced metal contamination risk
    • Stability through pad life
    • Uniformity in the chemical mechanical planarization (CMP) process
  • Application
    • Semiconductor Fabrication
    • Advanced Node (Memory & Logic)
    • Wafer Manufacturing
    • CMP
  • Overall Diameter (Imperial)30.5 in
    Overall Diameter (Metric)774.7 mm
  • Product UsageSemiconductor Wafers
  • Sales unitEA
    SAP Shelf Life In Days365
    Target Warehouse Location Lead Time60
    SAP External Material Group31000000
  • Base (B) - Billing UnitEA
    Base (B) - Customary Cubic Dimension494.51504 IN3
    Base (B) - Customary Gross Weight3.30236 LB
    Base (B) - Customary Net Weight2.60855 LB
    Base (B) - Metric Net Weight1.183014 KG
    Base (B) - Metric Cubic Dimension8103.618 CCM
    Base (B) - Item Quantity1
    Base (B) - UnitEA
  • Consumer (2) - Billing UnitEA
    Consumer (2) - Customary Cubic Dimension578.0022 IN3
    Consumer (2) - Customary Gross Weight13.57232 LB
    Consumer (2) - Customary Net Weight13.04273 LB
    Consumer (2) - Customary Height Dimension0.5 IN
    Consumer (2) - Customary Length Dimension34 IN
    Consumer (2) - Customary Width Dimension34 IN
    Consumer (2) - Metric Weight6.155248 KG
    Consumer (2) - Metric Net Weight5.91507 KG
    Consumer (2) - Metric Cubic Dimension9471.722 CCM
    Consumer (2) - Metric Height Dimension1.27 CM
    Consumer (2) - Metric Length Dimension86.36 CM
    Consumer (2) - Metric Width Dimension86.36 CM
    Consumer (2) - Item Quantity5
    Consumer (2) - UnitPAK
  • Inner (3) - Item Quantity0
  • Shipper (6) - Billing UnitEA
    Shipper (6) - Customary Cubic Dimension4945.15103 IN3
    Shipper (6) - Customary Gross Weight33.02365 LB
    Shipper (6) - Customary Net Weight26.08546 LB
    Shipper (6) - Customary Height Dimension4.1248 IN
    Shipper (6) - Customary Length Dimension34.6248 IN
    Shipper (6) - Customary Width Dimension34.6248 IN
    Shipper (6) - Metric Weight14.97671 KG
    Shipper (6) - Metric Net Weight11.83014 KG
    Shipper (6) - Metric Cubic Dimension81036.19 CCM
    Shipper (6) - Metric Height Dimension10.477 CM
    Shipper (6) - Metric Length Dimension87.947 CM
    Shipper (6) - Metric Width Dimension87.947 CM
    Shipper (6) - Item Quantity10
    Shipper (6) - UnitCS
  • Pallet (8) - Billing UnitEA
    Pallet (8) - Customary Cubic Dimension101299.81083 IN3
    Pallet (8) - Customary Gross Weight394.06658 LB
    Pallet (8) - Customary Net Weight26.08515 LB
    Pallet (8) - Customary Height Dimension50.25 IN
    Pallet (8) - Customary Length Dimension48 IN
    Pallet (8) - Customary Width Dimension42 IN
    Pallet (8) - Metric Weight178.715 KG
    Pallet (8) - Metric Net Weight11.83 KG
    Pallet (8) - Metric Cubic Dimension1660000.0 CCM
    Pallet (8) - Metric Height Dimension127.635 CM
    Pallet (8) - Metric Length Dimension121.92 CM
    Pallet (8) - Metric Width Dimension106.68 CM
    Pallet (8) - Item Quantity10
    Pallet (8) - UnitPAL