HEATGREASE
Thermal Conductive Grease for Heatsink
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound
HEATGREASE
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound
| Product Name | Thermal Conductive Grease for Heatsink |
|---|---|
| Product Number | HEATGREASE |
| UPC | 065030783422 |
| Lifecycle status | Discontinued |
| Warranty | 2 Years |
| Taxonomy | Product > Legacy Discontinued |
| Category Level 1 | Legacy Category |
| Category Level 2 | Legacy Sub-Category |
| Category Level 3 | Legacy Group |
| Country of Origin Europe & Japan | China |
| Country of Origin North America | China |
| Product Title (Short) | Thermal CPU Paste Compound for Heatsink |
|---|---|
| Product Title (Standard) | StarTech.com Thermal CPU Paste Compound for Heatsink - Thermal Conductive Grease for Heatsink - Processor heatsink paste |
| Product Title (Long) | Thermal CPU Paste Compound for Heatsink |
| Title Ingram (Part 1) | Thermal CPU Paste Compound for H |
| Title Ingram (Part 2) | eatsink |
| Website Product Headline | Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound |
| Bullet 1 | Ceramic-based compound containing silicone |
| Bullet 2 | Thermal conductivity of more than 1.066 W/m-K |
| Marketing Copy | |
| Applications |
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| Related Products |
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| TAA Compliant | No |
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| Carton Depth (mm) | 335 |
|---|---|
| Carton Height (mm) | 330 |
| Carton Quantity | 200 |
| Carton Weight Gross (g) | 5200 |
| Included in Package | 1 - Thermal Compound |
| Package Depth (mm) | 22 |
| Package Height (mm) | 152 |
| Package Width (mm) | 84 |
| Package Weight (g) | 20 |
| Packaging Description | Silicone Thermal CPU Paste |
| Packaging Description India | Silicone Thermal CPU Paste |
| Sub-Carton Depth (mm) | 0 |
| Sub-Carton Height (mm) | 0 |
| Sub-Carton Width (mm) | 0 |
| Sub-Carton Weight (g) | 0 |
| en-US Content Approved | Yes |
|---|---|
| Product Manager | Rafal Gwozdz |