HSFPHASECM
5pk T725 Phase Change Thermal Pad for Heatsinks
Improves heat transfer between a Microcontroller/chipset and heatsink with easy-to-use thermal pads
HSFPHASECM
Improves heat transfer between a Microcontroller/chipset and heatsink with easy-to-use thermal pads
| Product Name | 5pk T725 Phase Change Thermal Pad for Heatsinks |
|---|---|
| Product Number | HSFPHASECM |
| UPC | 065030809191 |
| Lifecycle status | End of Life |
| Warranty | 2 Years |
| Taxonomy | Product > Legacy Discontinued |
| Category Level 1 | Computer Cards and Adapters |
| Category Level 2 | Components, Tools and Accessories |
| Category Level 3 | Thermal Products |
| Family | No Family |
| Country of Origin Europe & Japan | Taiwan |
| Country of Origin North America | Taiwan |
| Country of Origin History (1) | Taiwan |
| Country of Origin Revision (1) | XXXXXX020X |
| Product Title (Short) | Heatsink Thermal Pads - Pack of 5 |
|---|---|
| Product Title (Standard) | StarTech.com Heatsink Thermal Pads - Pack of 5 - Thermal Pad - Thermal pad - gray (pack of 5 ) |
| Product Title (Long) | Heatsink Thermal Pads - Pack of 5 - TAA |
| Product Title (AMZ) | Heatsink Thermal Pads - Pack of 5 - Thermal Pad - Thermal pad - gray (pack of 5 ) (HSFPHASECM) |
| Title Ingram (Part 1) | Heatsink Thermal Pads - Pack of |
| Title Ingram (Part 2) | 5 |
| Website Product Headline | Improves heat transfer between a Microcontroller/chipset and heatsink with easy-to-use thermal pads |
| Bullet 1 | Low thermal impedance |
| Bullet 2 | Electrically non-conductive |
| Bullet 3 | Solid at room temperature, it softens at heatsink operating temperatures |
| Bullet 4 | Conforms to surface irregularities |
| Bullets (Consolidated) | Thermal pad - gray (pack of 5) |
| Marketing Copy | |
| Marketing Copy (No HTML) | |
| Applications | Replaces traditional heatsink grease |
| Website Search Keyword |
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| Required Regulatory Compliance Marks |
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| Special Notes | Heatsink/Component Clamping Pressure (Recommended): 5 to 100 PSI (0.035 to 0.690 MPa) |
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| Related Products |
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| Color | Pink |
|---|---|
| Material | Steel |
| Materials | |
| Operating Temperature | -60°C to 125°C (-76°F to 257°F) |
| Primary Material | Steel |
| Product Length (mm) | 30.000 |
| Product Width (mm) | 30.000 |
| Product Height (mm) | 0.130 |
| Product Weight (g) | 6.000 |
| TAA Compliant | Yes |
| Carton Depth (mm) | 310 |
|---|---|
| Carton Height (mm) | 210 |
| Carton Quantity | 400 |
| Carton Weight Gross (g) | 3500 |
| Included in Package | 5 - Thermal Pad |
| Number of Sub-Cartons | 40 |
| Package Depth (mm) | 90 |
| Package Height (mm) | 2 |
| Package Width (mm) | 125 |
| Package Quantity | 5 |
| Package Weight (g) | 8 |
| Packaging Description | Heatsink Thermal Pads - 5 Pk |
| Packaging Description India | Heatsink Thermal Pads - 5 Pk |
| Sub-Carton Depth (mm) | 0 |
| Sub-Carton Height (mm) | 0 |
| Sub-Carton Width (mm) | 0 |
| Sub-Carton Quantity | 10 |
| Sub-Carton Weight (g) | 0 |
| Amazon Merchandising Manager | Veronica Ye |
|---|---|
| Artwork Due Date | 2014-06-18 |
| Buying Center - AV & Collaboration | No |
| Buying Center - End User Compute | No |
| Buying Center - Networking & Edge | No |
| Enhanced Gallery Designer | Catherine Almeida |
| en-US Content Approved | Yes |
| Focus Rank | Level 0 - Not Applicable |
| Graphic Designer | Shane Arnett |
| Launch Markets (concatenated) | AT,BE,CA,CH,DE,DK,ES,EU,FR,IE,IT,NL,SE,UK,US |
| Primary Technology | None |
| Product Information Creation Specialist (PICS) | Alex Garcia |
| Product Manager | Natalie Goodale |
| Product Performance Specialist | Aaron Bens |
| Product Photographer | Alejandra Valencia |
| Tech Lead | Brian Linseman |
| Technical Writer | Andrew Richardson |
| Technology Lifecycle | None |